Title :
The 3D numerical simulation of stress field coupled with temperature field in cutting process
Author :
Yang, Yi ; Feng, Keqin ; Bi, Lei ; Jiang, Yuming ; Feng, Bin
Keywords :
Capacitive sensors; Cutting tools; Deformable models; Machining; Milling; Numerical simulation; Optical wavelength conversion; Plastics; Residual stresses; Temperature distribution;
Conference_Titel :
Intelligent Mechatronics and Automation, 2004. Proceedings. 2004 International Conference on
Print_ISBN :
0-7803-8748-1
DOI :
10.1109/ICIMA.2004.1384293
