• DocumentCode
    2390061
  • Title

    Automatic wire bonder designed for MEMS packaging

  • Author

    Liu, Yanjie ; Liu, Yuetao ; Sun, Lining

  • Author_Institution
    Robot. Inst., Harbin Inst. of Technol., Harbin
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    21
  • Lastpage
    23
  • Abstract
    This paper introduces zoom microscope into the microscope positioning system to settle the contradiction between microscopepsilas visual range and depth of field. In the whole bonding application, bond targetspsila identification and orientation are the most important aspects for full-automation. Multiple scale images go through various image processing programs, and finally different bond targets are identified and positioned This measure is called ldquoglobal-coarse and local-precise orientationrdquo, with which full-automation bonding is realized. A zoom microscope based micro-positioning system was used to capture the multiple magnification images. The requirement for real-time auto-focusing for zoom microscope is proposed based on the analysis of zoom microscope model.
  • Keywords
    integrated circuit packaging; micromechanical devices; MEMS packaging; automatic wire bonder; bond targets identification; bonding application; full-automation; global-coarse orientation; image processing programs; local-precise orientation; microscope positioning system; microscope visual range; real-time auto-focusing; zoom microscope; Bonding; Equations; Focusing; Lenses; Machine vision; Micromechanical devices; Microscopy; Optical imaging; Packaging; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
  • Conference_Location
    Nice
  • Print_ISBN
    978-2-35500-006-5
  • Type

    conf

  • DOI
    10.1109/DTIP.2008.4752944
  • Filename
    4752944