DocumentCode
2390061
Title
Automatic wire bonder designed for MEMS packaging
Author
Liu, Yanjie ; Liu, Yuetao ; Sun, Lining
Author_Institution
Robot. Inst., Harbin Inst. of Technol., Harbin
fYear
2008
fDate
9-11 April 2008
Firstpage
21
Lastpage
23
Abstract
This paper introduces zoom microscope into the microscope positioning system to settle the contradiction between microscopepsilas visual range and depth of field. In the whole bonding application, bond targetspsila identification and orientation are the most important aspects for full-automation. Multiple scale images go through various image processing programs, and finally different bond targets are identified and positioned This measure is called ldquoglobal-coarse and local-precise orientationrdquo, with which full-automation bonding is realized. A zoom microscope based micro-positioning system was used to capture the multiple magnification images. The requirement for real-time auto-focusing for zoom microscope is proposed based on the analysis of zoom microscope model.
Keywords
integrated circuit packaging; micromechanical devices; MEMS packaging; automatic wire bonder; bond targets identification; bonding application; full-automation; global-coarse orientation; image processing programs; local-precise orientation; microscope positioning system; microscope visual range; real-time auto-focusing; zoom microscope; Bonding; Equations; Focusing; Lenses; Machine vision; Micromechanical devices; Microscopy; Optical imaging; Packaging; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location
Nice
Print_ISBN
978-2-35500-006-5
Type
conf
DOI
10.1109/DTIP.2008.4752944
Filename
4752944
Link To Document