DocumentCode
2390228
Title
High quality factor silicon cantilever driven by PZT actuator for resonant based mass detection
Author
Lu, Jun ; Ikehara, T. ; Zhang, Ye ; Mihara, T. ; Itoh, Takayuki ; Maeda, Ryutaro
Author_Institution
Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba
fYear
2008
fDate
9-11 April 2008
Firstpage
60
Lastpage
65
Abstract
A high quality factor (Q-factor) piezoelectric lead zirconat titanate (PZT) film actuated single crystal silicon cantilever was proposed in this paper for resonant based ultra sensitive mass detection. Intrinsic energy dissipation and other negative effects from PZT film were successfully compressed by separating the PZT actuator from the resonant structure. Excellent Q-factor, which is comparable to silicon only cantilever and several times larger than latest reported Q-factor of integrated cantilevers, was successfully obtained under both atmospheric pressure and reduced pressures. For a 30 mum-wide 100 mum-long cantilever, Q-factor was measured as high as 1113 and 7279 under the pressure of 101.2 KPa and 35 Pa, respectively. Moreover, it was found that high mode vibration can be achieved for the pursuit of great Q-factor. However, support loss became significant because of the increase of PZT actuatorpsilas vibration amplitude. Therefore, an optimized structure using node-point actuation was discussed and suggested herein.
Keywords
Q-factor; cantilevers; elemental semiconductors; lead compounds; mass measurement; micromechanical devices; piezoelectric actuators; piezoelectric thin films; silicon; vibrations; PZT; PZT actuator; Q-factor; Si; actuated single crystal silicon cantilever; energy dissipation; high mode vibration; integrated cantilevers; node-point actuation; piezoelectric lead zirconate titanate film; quality factor; resonant based ultrasensitive mass detection; size 100 mum; size 30 mum; Actuators; Atmospheric measurements; Energy dissipation; Piezoelectric films; Pressure measurement; Q factor; Resonance; Semiconductor films; Silicon; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location
Nice
Print_ISBN
978-2-35500-006-5
Type
conf
DOI
10.1109/DTIP.2008.4752953
Filename
4752953
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