DocumentCode :
2390273
Title :
Can InAlN/GaN be an alternative to high power / high temperature AlGaN/GaN devices?
Author :
Medjdoub, F. ; Carlin, J.-F. ; Gonschorek, M. ; Feltin, E. ; Py, M.A. ; Ducatteau, D. ; Gaquière, C. ; Grandjean, N. ; Kohn, E.
Author_Institution :
Ulm Univ.
fYear :
2006
fDate :
11-13 Dec. 2006
Firstpage :
1
Lastpage :
4
Abstract :
The performance of novel AlInN/GaN HEMTs for high power / high temperature applications is discussed. With 0.25 mum gate length the highest maximum output current density of more than 2 A/mm at room temperature and more than 3 A/mm at 77 K have been obtained even with sapphire substrates. Cut-off frequencies were fT = 50 GHz and fMAX = 60 GHz for 0.15 mum gate length without T-gate. Pulsed measurements reveal a less unstable surface than in the case of AlGaN/GaN structures. Although limited by buffer layer leakage, with field plates a maximum drain bias of 100 V has been reached with these devices. The high chemical stability of this unstrained heterostructure and its surface has been demonstrated with successful operation at 1000 degC in vacuum
Keywords :
III-V semiconductors; aluminium compounds; buffer layers; gallium compounds; indium compounds; power HEMT; sapphire; wide band gap semiconductors; 0.15 micron; 0.25 micron; 100 V; 1000 C; 50 GHz; 60 GHz; 77 K; AlGaN-GaN; HEMT; InAlN-GaN; buffer layer leakage; high chemical stability; high power devices; high temperature devices; pulsed measurements; unstrained heterostructure; Aluminum gallium nitride; Buffer layers; Chemicals; Current density; Cutoff frequency; Gallium nitride; HEMTs; MODFETs; Pulse measurements; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location :
San Francisco, CA
Print_ISBN :
1-4244-0439-8
Electronic_ISBN :
1-4244-0439-8
Type :
conf
DOI :
10.1109/IEDM.2006.346935
Filename :
4154370
Link To Document :
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