Title :
Through silicon vias as enablers for 3D systems
Author :
Jung, Erik ; Ostmann, A. ; Ramm, P. ; Wolf, J. ; Toepper, M. ; Wiemer, M.
Author_Institution :
Fraunhofer IZM, Berlin
Abstract :
This special session on 3D TSVpsilas will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSVpsilas.
Keywords :
elemental semiconductors; semiconductor industry; silicon; 3D systems; Si; active circuit frontside; complex systems; enablers; through silicon vias; Circuits; Dielectrics and electrical insulation; Filling; Micromechanical devices; Radio frequency; Routing; Semiconductor materials; Silicon; Substrates; Wet etching;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location :
Nice
Print_ISBN :
978-2-35500-006-5
DOI :
10.1109/DTIP.2008.4752965
