Title :
Copper electrodeposition for 3D integration
Author :
Beica, Rozalia ; Sharbono, Charles ; Ritzdorf, Tom
Author_Institution :
Semitool, Kalispell, MT
Abstract :
Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages has driven the semiconductor industry to develop more advanced packaging technologies.
Keywords :
copper; electrodeposition; filling; integrated circuit interconnections; 3D chip integration; 3D packaging technologies; Cu; IC integration; copper damascene interconnects; copper electrodeposition; fill processes; three-dimensional integration; through silicon via copper; two dimensional integration; wafer design; Consumer electronics; Copper; Electronics industry; Electronics packaging; Integrated circuit packaging; Semiconductor device packaging; Silicon; Stacking; Through-silicon vias; Wire;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location :
Nice
Print_ISBN :
978-2-35500-006-5
DOI :
10.1109/DTIP.2008.4752967
