DocumentCode :
2390600
Title :
Process nano scale mechanical properties measurement of thin metal films using a novel paddle cantilever test structure
Author :
Tong, Chi-Jia ; Lin, Ming-Tzer
Author_Institution :
Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung
fYear :
2008
fDate :
9-11 April 2008
Firstpage :
132
Lastpage :
137
Abstract :
A new technique was developed for studying the mechanical behavior of nano-scale thin metal films on substrate is presented. The test structure was designed on a novel ldquopaddlerdquo cantilever beam specimens with dimensions as few hundred nanometers to less than 10 nanometers. This beam is in triangle shape in order to provide uniform plane strain distribution. Standard clean room processing was used to prepare the paddle sample. The experiment can be operated by using the electrostatic deflection on the ldquopaddlerdquo uniform distributed stress cantilever beam and then measure the deposited thin metal film materials on top of it. A capacitance technique was used to measurement on the other side of the deflected plate to measure its deflection with respect to the force. The measured strain was converted through the capacitance measurement for the deflection of the cantilever. System performance on the residual stress measurement of thin films are calculated with three different forces on the ldquopaddlerdquo cantilever beam, including the force due to the film, compliance force and electrostatic force.
Keywords :
internal stresses; mechanical variables measurement; metallic thin films; nanostructured materials; clean room processing; electrostatic deflection; electrostatic force; nanoscale mechanical properties; paddle cantilever test structure; paddle sample; paddle uniform distributed stress cantilever beam; plane strain distribution; residual stress; thin metal films; Capacitance measurement; Electrostatic measurements; Force measurement; Mechanical factors; Mechanical variables measurement; Strain measurement; Stress measurement; Structural beams; Substrates; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location :
Nice
Print_ISBN :
978-2-35500-006-5
Type :
conf
DOI :
10.1109/DTIP.2008.4752968
Filename :
4752968
Link To Document :
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