Title :
Micro-electroforming metallic bipolar electrodes for mini-DMFC stacks
Author :
Shyu, R.F. ; Yang, H. ; Lee, J.-H.
Author_Institution :
Dept. of Mech. Manuf. Eng., Nat. Formosa Univ., Yunlin
Abstract :
This paper describes the development of metallic bipolar plate fabrication using micro-electroforming process for mini-DMFC (direct methanol fuel cell) stacks. Ultraviolet (UV) lithography was used to define micro-fluidic channels using a photomask and exposure process. Micro-fluidic channels mold with 300 mum thick and 500 mum wide were firstly fabricated in a negative photoresist onto a stainless steel plate. Copper micro-electroforming was used to replicate the micro-fluidic channels mold. Following by sputtering silver (Ag) with 1.2mum thick, the metallic bipolar plates were completed. The silver layer is used for corrosive resistance. The completed mini-DMFC stack is a 2times2 cm2 fuel cell stack including a 1.5 times 1.5 cm2 MEA (membrane electrode assembly). Several MEAs were assembly into mini-DMFC stacks using the completed metallic bipolar plates. All test results showed the metallic bipolar plates suitable for mini-DMFC stacks. The maximum output power density is 9.3mW/cm2 and current density is 100 mA/cm2 when using 8 vol. % methanol as fuel and operated at temperature 30degC. The output power result is similar to other reports by using conventional graphite bipolar plates. However, conventional graphite bipolar plates have certain difficulty to be machined to such micro-fluidic channels. The proposed micro-electroforming metallic bipolar plates are feasible to miniaturize DMFC stacks for further portable 3C applications.
Keywords :
copper; direct methanol fuel cells; electroforming; graphite; microfluidics; photoresists; silver; ultraviolet lithography; copper micro-electroforming; direct methanol fuel cell; graphite bipolar plates; membrane electrode assembly; metallic bipolar plate fabrication; micro-electroforming metallic bipolar electrodes; micro-fluidic channels; mini-DMFC stacks; photomask; photoresist; size 300 mum; size 500 mum; sputtering silver; stainless steel plate; temperature 30 degC; ultraviolet lithography; Assembly; Electrodes; Fabrication; Fuel cells; Lithography; Methanol; Power generation; Resists; Silver; Steel;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location :
Nice
Print_ISBN :
978-2-35500-006-5
DOI :
10.1109/DTIP.2008.4752982