DocumentCode :
2390868
Title :
Dynamic multi-physics model for solar array
Author :
Liu, Shengyi ; Dougal, Roger A.
Author_Institution :
South Carolina Univ., SC, USA
Volume :
1
fYear :
2002
fDate :
25-25 July 2002
Abstract :
Summary form only given, as follows. An approach to model the solar cell system with coupled multi-physics equations (photovoltaic, electro-thermal, direct heating and cooling processes) within the context of the resistive-companion method in the Virtual Test Bed computational environment is presented. Appropriate across and through variables are defined for the thermal terminal of the system so that temperature is properly represented as a state variable, rather than as a parameter of the system. This allows enforcement of the system power conservation through all terminals, and allows simultaneous solutions for both the electrical potentials and the system temperature. The thermal port built accordingly can be used for natural thermal coupling. The static and dynamic behaviors of the solar array model based on the approach are obtained and validated through comparison of simulation results to theoretical predictions and other reported data. The electro-thermal modeling method developed here can be generally used in the modeling of other devices, and the method to define the across and through variables can also be generalized to any other interdisciplinary processes where natural coupling is required.
Keywords :
cooling; heating; semiconductor device models; solar cell arrays; thermal analysis; Virtual Test Bed computational environment; direct cooling processes; direct heating processes; dynamic behaviors; electro-thermal processes; natural thermal coupling; photovoltaic processes; solar array dynamic multi-physics model; static behaviors; Context modeling; Cooling; Equations; Photovoltaic cells; Photovoltaic systems; Predictive models; Solar heating; Solar power generation; System testing; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Engineering Society Summer Meeting, 2002 IEEE
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-7518-1
Type :
conf
DOI :
10.1109/PESS.2002.1043195
Filename :
1043195
Link To Document :
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