Title :
Characteristics and potential application of polyimide-core-bump to flip chip
Author :
Nishimori, Takashi ; Yanagihara, Hiroshi ; Murayama, IKeiji ; Kama, Yasunori ; Nakamura, Misa
Author_Institution :
Dept. of Technol., Tanaka Kikinzoku Kogyo K.K., Kanagawa, Japan
Abstract :
Polyimide core bumps are formed by following steps: firstly, forming polyimide cores using photosensitive polyimide; next, metallization on the polyimide cores by sputtering; and finally, patterning the metallized layers. The polyimide core bumps thus prepared have the advantages of larger aspect ratios, and better bump height uniformity without conventional levelling process, and larger elasticity compared with solid metal bumps such as gold or solder. Also various bonding methods are applicable, such as soldering, or gold-tin bonding with pressure and adhering, or other mechanical contact with adhesive
Keywords :
adhesion; elasticity; flip-chip devices; mechanical strength; metallisation; microassembling; polymer films; soldering; sputtering; Au-Sn; Au-Sn bonding; adhesive; bonding methods; flip chip; mechanical contact; metallization; metallized layer patterning; photosensitive polyimide; polyimide-core-bump; soldering; sputtering; Bonding; Coatings; Flip chip; Gold; Metallization; Passivation; Polyimides; Resists; Sputter etching; Sputtering;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.515330
