Characteristics and potential application of polyimide-core-bump to flip chip

Author

Nishimori, Takashi ; Yanagihara, Hiroshi ; Murayama, IKeiji ; Kama, Yasunori ; Nakamura, Misa

Author_Institution

Dept. of Technol., Tanaka Kikinzoku Kogyo K.K., Kanagawa, Japan

fYear

1995

fDate

21-24 May 1995

Firstpage

515

Lastpage

519

Abstract

Polyimide core bumps are formed by following steps: firstly, forming polyimide cores using photosensitive polyimide; next, metallization on the polyimide cores by sputtering; and finally, patterning the metallized layers. The polyimide core bumps thus prepared have the advantages of larger aspect ratios, and better bump height uniformity without conventional levelling process, and larger elasticity compared with solid metal bumps such as gold or solder. Also various bonding methods are applicable, such as soldering, or gold-tin bonding with pressure and adhering, or other mechanical contact with adhesive

Keywords

adhesion; elasticity; flip-chip devices; mechanical strength; metallisation; microassembling; polymer films; soldering; sputtering; Au-Sn; Au-Sn bonding; adhesive; bonding methods; flip chip; mechanical contact; metallization; metallized layer patterning; photosensitive polyimide; polyimide-core-bump; soldering; sputtering; Bonding; Coatings; Flip chip; Gold; Metallization; Passivation; Polyimides; Resists; Sputter etching; Sputtering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.515330

Filename

515330