Title :
ARPA analog optoelectronic module program: packaging challenges for analog optoelectronic arrays
Author :
Hsu, H.P. ; Yap, D. ; Ng, W. ; Yen, H.W. ; Armiento, C. ; Tabasky, M. ; Mehr, J. ; Negri, A. ; Haugsjaa, P.
Author_Institution :
Hughes Res. Labs., Malibu, CA, USA
Abstract :
This paper describes the packaging challenges associated with array-based transmitters and receivers used for analog fiber-optic links. The optoelectronic modules are being developed under an ARPA Analog Optoelectronic Module TRP. The paper will focus on the development of optoelectronic array modules using silicon waferboard technology for application to personal communication systems
Keywords :
arrays; integrated optoelectronics; modules; optical communication equipment; optical fibre communication; packaging; ARPA Analog Optoelectronic Module TRP; analog fiber-optic links; optoelectronic array modules; packaging; personal communication systems; receivers; silicon waferboard technology; transmitters; Costs; Laboratories; Optical arrays; Optical fiber communication; Optical fibers; Optical receivers; Optical sensors; Optical transmitters; Packaging; Silicon;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.515339
