DocumentCode :
2391319
Title :
Large area roller embossing of multilayered ceramic green composites
Author :
Shan, Xuechuan ; Soh, Y.C. ; Shi, C.W.P. ; Tay, C.K. ; Lu, C.W.
Author_Institution :
Singapore Inst. of Manuf. Technol., Singapore
fYear :
2008
fDate :
9-11 April 2008
Firstpage :
314
Lastpage :
319
Abstract :
This paper presents our latest achievements in developing large area patterning of multilayered ceramic green composites using micro roller embossing. The aim of this research is to develop large area pattern technique for ceramic green substrates using a modified roller laminator, which is compatible with screen printing apparatus, for integration of micro embossing and printing in the future stage. A thin film nickel mold was developed via photolithography, nickel electroplating and photoresist strip-off. The mold had an effective panel size of 150 mmtimes 150 mm with the height of protrusive micro patterns being about 40 mum. Formation of micro patterns was successfully demonstrated over the whole panel area using roller embossing on laminated ceramic green tapes (HL2000 from Heraeus). Micro patterns for inductors, capacitors as well as interconnection with 50 mum line width were embossed on ceramic green substrates. With the optimized process parameters (including feeding speed, roller temperature and applied pressure), we have demonstrated that micro roller embossing is a promising method for large area patterning of ceramic green substrates.
Keywords :
ceramics; composite materials; electroplating; embossing; interconnections; multilayers; photolithography; photoresists; Ni; capacitors; ceramic green substrates; inductors; interconnection; microroller embossing; modified roller laminator; multilayered ceramic green composites; nickel electroplating; optimized process parameters; photolithography; photoresist strip-off; protrusive micropatterns; roller temperature; screen printing apparatus; thin film nickel mold; Capacitors; Ceramics; Embossing; Inductors; Lithography; Nickel; Printing; Resists; Substrates; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location :
Nice
Print_ISBN :
978-2-35500-006-5
Type :
conf
DOI :
10.1109/DTIP.2008.4753009
Filename :
4753009
Link To Document :
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