• DocumentCode
    2391361
  • Title

    Software support for packaging design of wireless equipment (SPEC-a simulator for RF active, passive devices, and interconnections)

  • Author

    Jagiello, K.W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ
  • fYear
    1995
  • fDate
    21-24 May 1995
  • Firstpage
    614
  • Lastpage
    617
  • Abstract
    Design time constrains and high quality standards in manufacturing contemporary wireless products as well as their complexity create a need for computer tools helping to meet these conditions. This paper reports the development of a new software system for Computer Aided Design of microelectronic circuits in wireless hardware. The major part of the system consists of a quick simulator which performs transient analysis using a spectral technique. The other components of the system allow for automation of analyses and postprocessing of data from a simulation. The entire system forms a flexible and portable framework which fills gaps between existing applications. An example of using the system to generate design curves for antenna amplifiers will be presented. RF circuits working at high frequencies exhibit sometimes chaotic behavior. Analysing that behavior using traditional approaches is inefficient and sometimes even impossible. Applying new mathematical tools like Lyapunov Exponents, Surfaces of Section, etc. simplifies the analysis and opens new possibilities for automation design procedures
  • Keywords
    circuit CAD; circuit analysis computing; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; radio equipment; telecommunication computing; Lyapunov exponents; RF circuits; SPEC; active devices; antenna amplifiers; chaos; computer aided design; design automation; interconnections; microelectronic circuits; packaging; passive devices; simulator; software support; spectral technique; surfaces of section; transient analysis; wireless equipment; Analytical models; Circuit simulation; Computational modeling; Computer aided manufacturing; Hardware; Microelectronics; Packaging machines; Software packages; Software systems; Time factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1995. Proceedings., 45th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2736-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1995.515346
  • Filename
    515346