Title :
Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)
Author :
Barrett, J. ; Cahill, C. ; Compagno, T. ; Flaherty, Martin O. ; Hayes, T. ; Lawton, W. ; Donavan, J.O. ; Mathúna, C.O. ; McCarthy, G. ; Slattery, O. ; Waldron, F. ; Vera, A. Coella ; Masgrangeas, M. ; Pipard, P. ; Val, C. ; Serthelon, I.
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
Abstract :
The performance and reliability of a low-cost three-dimensional plastic moulded vertical multi-chip module concept is presented. Performance was evaluated using custom designed chips incorporating thermal, thermomechanical, electrical and reliability test structures. Results of performance are presented and are shown to correlate well with thermal, thermomechanical and electrical simulations. The thermal and thermomechanical performances are sufficient to allow use of the MCM-V technique in a wide range of applications without the need for special cooling techniques. Reliability testing to space level standards was carried out on 53 technology demonstrator modules incorporating the test chips and a high level of reliability has been demonstrated
Keywords :
corrosion; integrated circuit reliability; integrated circuit testing; multichip modules; plastic packaging; thermal analysis; 3D plastic moulded vertical MCM; MCM reliability; MCM-V technique; low-cost type; reliability testing; space level standards; thermal performance; thermomechanical performance; three-dimensional vertical MCM; vertical multichip module; Collaboration; Fabrication; Metallization; Microelectronics; Multichip modules; Packaging; Plastics; Space technology; Testing; Thermomechanical processes;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.515352
