Title : 
Metaheuristics for the 3D bin packing problem in the steel industry
         
        
            Author : 
Viegas, Joaquim P. L. ; Vieira, Susana M. ; Sousa, Joao M. C. ; Henriques, Elsa M. P.
         
        
            Author_Institution : 
Inst. Super. Tecnico, Univ. of Lisbon, Lisbon, Portugal
         
        
        
        
        
        
            Abstract : 
This work presents heuristic and metaheuristic approaches for addressing the real-world steel cutting problem of a retail steel distributor as a cutting & packing problem. It consists of the cutting of large steel blocks in order to obtain smaller pieces ordered by clients. The problem was formulated as a 3-dimensional residual bin packing problem for minimization of scrap generation, with guillotine cutting constraint and chips scrap generation. A tabu search and bestfit decreasing (BFD) approaches are proposed and their performance compared to an heuristic and ant colony optimization (ACO) algorithms. It´s shown that the tabu search and best-fit decreasing algorithm are able to reduce the generated scrap by up to 52% in comparison with the heuristic in [1]. The orders to suppliers were also reduced by up to 35%. The analysis of the results of the different approaches provide insight onto the most important factors in the problem´s scrap minimization.
         
        
            Keywords : 
bin packing; minimisation; search problems; steel industry; 3-dimensional residual bin packing problem; 3D bin packing problem metaheuristics; ACO; BFD; ant colony optimization algorithms; best-fit decreasing approaches; chips scrap generation; cutting problem; guillotine cutting constraint; large steel blocks; real-world steel cutting problem; retail steel distributor; scrap generation minimization; steel industry; tabu search; Algorithm design and analysis; Heuristic algorithms; Linear programming; Niobium; Steel; Three-dimensional displays;
         
        
        
        
            Conference_Titel : 
Evolutionary Computation (CEC), 2014 IEEE Congress on
         
        
            Conference_Location : 
Beijing
         
        
            Print_ISBN : 
978-1-4799-6626-4
         
        
        
            DOI : 
10.1109/CEC.2014.6900515