DocumentCode :
2391548
Title :
Electrostatically driven microgripper integrated piezoresistive force sensor
Author :
Chen, Tao ; Chen, Liguo ; Sun, Lining ; Li, Xinxin
Author_Institution :
State Key Lab. of Robot. & Syst., Robot. Inst., Harbin
fYear :
2008
fDate :
9-11 April 2008
Firstpage :
376
Lastpage :
380
Abstract :
This paper presents the design, fabrication, and application of an electrostatically driven microgripper integrated piezoresistive force sensor. The microgripper is designed to manipulate two microobjects at the same time with force sensing ability. Surface and bulk micromachining technology is employed to fabricate the microgripper from single crystal silicon wafer. The end effector of the gripper is a four arms structure, two fixed cantilever beams integrated with piezoresistive sensor are designed to sensing the gripping force, and an electrostatically driven microactuator is designed to provide the force to operate the other two movable arms. In this way, the four fingers structure enables the gripper to grasp two samples with different sizes at the same time. Experimental results show that it can successfully provide force sensing and play a main role in preventing damage of microparts in micromanipulation and microassembly tasks.
Keywords :
cantilevers; electrostatic actuators; elemental semiconductors; end effectors; force sensors; grippers; microassembling; micromachining; micromanipulators; piezoelectric devices; silicon; Si; bulk micromachining technology; electrostatically driven microgripper; end effector; fabrication technology; fingers structure; fixed cantilever beams; force sensing ability; integrated piezoresistive force sensor; microactuator; microassembly tasks; micromanipulation tasks; microobject manipulation; micropart damage prevention; single crystal silicon wafer; surface micromachining technology; Arm; End effectors; Fabrication; Force sensors; Grippers; Microactuators; Micromachining; Piezoresistance; Silicon; Structural beams;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location :
Nice
Print_ISBN :
978-2-35500-006-5
Type :
conf
DOI :
10.1109/DTIP.2008.4753023
Filename :
4753023
Link To Document :
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