DocumentCode :
2391791
Title :
PDMS-based conformable microelectrode arrays with selectable novel 3-D microelectrode geometries for surface stimulation and recording
Author :
Guo, Liang ; DeWeerth, Stephen P.
Author_Institution :
Dept. of Biomed. Eng., Georgia Inst. of Technol. & Emory Univ., Atlanta, GA, USA
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
1623
Lastpage :
1626
Abstract :
A method for fabricating polydimethylsiloxane (PDMS) based conformable microelectrode arrays (MEAs) with selectable novel 3-D microelectrode geometries is presented. Simply recessed, conically recessed, exponentially recessed, and protruded-well microelectrodes have been fabricated on the MEA with a diameter as small as 10 mum. 3-D microelectrode geometry parameters (recess depth, recess slope & profile, and protrusion/planar) can be controlled independently during fabrication. Exponentially and conically recessed microelectrodes are promising in chronic stimulation applications, such as neural prostheses, for their production of a uniform current density profile during stimulation, which can minimize stimulation-induced tissue burning and electrode corrosion. Protruded-well microelectrodes potentially provide a closer and sealed contact to the target tissue surface, avoiding current leakage during stimulation and thus achieving better stimulation efficiency in both charge delivery and spatial specificity.
Keywords :
bioelectric phenomena; biological tissues; biomedical electrodes; microelectrodes; microfabrication; neurophysiology; polymers; prosthetics; 3D microelectrode geometry; PDMS-based conformable microelectrode arrays fabrication; chronic stimulation; conically recessed microelectrodes; current leakage; electrode corrosion; neural prostheses; neurophysiology; polydimethylsiloxane; stimulation-induced tissue burning; surface stimulation; Dimethylpolysiloxanes; Electric Stimulation; Microelectrodes; Surface Properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5333446
Filename :
5333446
Link To Document :
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