VAX 9000 packaging-the multi chip unit

Author

Marshall, Donald E. ; McElroy, James B., Sr.

Author_Institution

Digital Equipment Corp., Boxborough, MA, USA

fYear

1990

fDate

Feb. 26 1990-March 2 1990

Firstpage

54

Lastpage

57

Abstract

The VAX 9000 achieves its high performance through the use of high-speed hardware and architectural features that reduce both cycle time and cycles per instruction execution. The multi chip unit (MCU), the heart of the high-density packaging approach which makes the fast cycle time possible, is described. The performance analysis that led to the selection of this packaging technology is reviewed. This is followed by a brief description of the semiconductors and an overview of the MCU, its components, and their performance. The VAX 9000 logic is based on the Motorola MCAIII emitter-coupled-logic gate array technology. Housing and connector features are briefly examined.<>

Keywords

DEC computers; VLSI; integrated circuit technology; mainframes; packaging; parallel architectures; parallel machines; Motorola MCAIII emitter-coupled-logic gate array; VAX 9000 logic; VAX 9000 packaging; connector features; housing features; multi chip unit; performance analysis; semiconductors; CMOS logic circuits; CMOS technology; Clocks; Delay estimation; Electronics packaging; Hardware; Integrated circuit interconnections; Logic arrays; Semiconductor device packaging; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Compcon Spring '90. Intellectual Leverage. Digest of Papers. Thirty-Fifth IEEE Computer Society International Conference.

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-8186-2028-5

Type

conf

DOI

10.1109/CMPCON.1990.63653

Filename

63653