Title :
Lumped-element sections for modeling coupling between high-speed digital and I/O lines
Author :
Cui, W. ; Shi, H. ; Luo, X. ; Sha, F. ; Drewniak, J.L. ; Van Doren, T.P. ; Anderson, T.
Author_Institution :
Electromagnetic Compatibility Lab., Missouri Univ., Rolla, MO, USA
Abstract :
Lumped-element sections are used for modeling coupling between high-speed digital and I/O lines on printed circuit boards (PCBs) in this paper. Radiated electromagnetic interference (EMI) is investigated when the I/O line going off the board is driven as an unintentional, but effective antenna. Simulated results are compared with measurements for coupled lines. A suitable number of lumped-element sections for modeling is chosen based on the line length and the highest frequency of interest
Keywords :
electromagnetic interference; lumped parameter networks; printed circuits; transmission line theory; I/O lines; PCB; antenna; coupling modeling; high-speed digital lines; lumped-element sections; printed circuit boards; radiated EMI; radiated electromagnetic interference; Cables; Circuit simulation; Clocks; Coupling circuits; Distributed parameter circuits; Electromagnetic compatibility; Electromagnetic interference; Frequency; Impedance; Resonance;
Conference_Titel :
Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4140-6
DOI :
10.1109/ISEMC.1997.667685
