Title :
Characterization of p++ layer fabrication using a liquid source for MEMS applications
Author :
Iliescu, C. ; Avram, M. ; Miao, J. ; Tay, F.E.H.
Author_Institution :
Inst. of Bioeng. & Nanotechnologies, Singapore
fDate :
28 Sept.-2 Oct. 2003
Abstract :
This paper presents the fabrication of boron etch stop layer using spin on dopants and its applications in MEMS: thin diaphragm, cantilevers fabricated by surface and bulk micromachining process. The doping profile was simulated using T-Supreme4. The stress induces in this layer was analyzed using a TENCOR stress measurement. In addition, the surface roughness was measured by AFM analysis. Diaphragms and cantilevers (fabricated using bulk and surface micromachining) were successfully processed using etch-stop techniques.
Keywords :
atomic force microscopy; etching; micromachining; micromechanical devices; semiconductor doping; stress measurement; AFM analysis; B etch stop layer; MEMS applications; T-Supreme4; TENCOR stress measurement; cantilevers; doping profile; liquid source; micromachining process; p++ layer fabrication; surface roughness; thin diaphragm; Boron; Etching; Fabrication; Micromachining; Micromechanical devices; Residual stresses; Rough surfaces; Silicon; Stress measurement; Surface roughness;
Conference_Titel :
Semiconductor Conference, 2003. CAS 2003. International
Print_ISBN :
0-7803-7821-0
DOI :
10.1109/SMICND.2003.1252435
