Title :
Restructurable VLSI-a demonstrated wafer-scale technology
Author :
Wyatt, Peter W. ; Raffel, Jack I.
Author_Institution :
MIT Lincoln Lab., Lexington, MA, USA
Abstract :
Restructurable VLSI (RVLSI) is an approach to wafer-scale integration which has been demonstrated by building six different monolithic silicon, wafer-scale chips for signal processing applications. It is based on the implementation of redundancy by laser microwelding on a finished, tested, packaged wafer. The concept of RVLSI is discussed, the chips built to data are reviewed, and some of the major issues are introduced. Three other papers describe in more detail the laser technology, the software created to design, test, and restructure these systems, some of the knowledge acquired in designing and building the first six circuit types, and the current application of the techniques to new, much more complex designs
Keywords :
VLSI; laser beam machining; redundancy; RVLSI; circuit types; complex designs; laser microwelding; laser technology; redundancy; restructurable VLSI; signal processing; wafer-scale integration; wafer-scale technology; Application software; Circuit testing; Optical design; Packaging; Paper technology; Signal processing; Silicon; Software design; Very large scale integration; Wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9901-9
DOI :
10.1109/WAFER.1989.47531