Title :
Numerical analysis of a comprehensive in silico subcutaneous insulin absorption compartmental model
Author :
Sebald, Daniel ; Ruchti, Timothy
Author_Institution :
Global Device R&D Dept. of Hospira, Inc., Lake Forest, IL, USA
Abstract :
Development of safe and effective glucose management algorithms for remediation of inpatient hyperglycemia reduces nursing workload and improves patient outcomes by providing decision support at the bedside. Computer simulation of drug pharmacokinetics and pharmacodynamics enables evaluation and testing of glycemic control algorithms prior to in vivo investigations without risk to patients. For subcutaneous insulin dosing, in silico testing requires an accurate model of diffusion and availability of insulin from the time of injection. Wong et al. have recently proposed a comprehensive compartmental model of pharmacokinetics for six types of insulin to serve as the basis for available brands. The compartmental model is efficient for processing a large number of virtual patients. Herein we analyze numerical integration properties for the Wong et al. model, as a guide for achieving peak efficiency of simulations.
Keywords :
biological fluid dynamics; decision support systems; drug delivery systems; drugs; medical computing; numerical analysis; sorption; sugar; bedside decision support; diffusion model; drug pharmacokinetics; glucose management algorithms; glycemic control algorithms; in silico subcutaneous insulin absorption compartmental model; in silico testing; inpatient hyperglycemia remediation; insulin dosing; numerical analysis; numerical integration properties; nursing workload; pharmacodynamics; Absorption; Algorithms; Chemistry, Pharmaceutical; Computer Simulation; Humans; Hyperglycemia; Infusions, Subcutaneous; Insulin; Insulin Infusion Systems; Linear Models; Models, Statistical; Models, Theoretical; Software; Technology, Pharmaceutical; Time Factors;
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2009.5333563