DocumentCode :
2394035
Title :
Drastically improved NBTI lifetime by periodic plasma nitridation for 90 nm mobile applications at low voltage operation
Author :
Kawae, T. ; Minemura, Y. ; Fukuda, S. ; Hirano, T. ; Suzuki, Y. ; Saito, M. ; Kadomura, S. ; Samukawa, S.
Author_Institution :
Inst. of Fluid Sci., Tohoku Univ., Sendai, Japan
fYear :
2003
fDate :
6-7 Nov. 2003
Firstpage :
146
Lastpage :
149
Abstract :
The controlling concentration and location of nitrogen in SiON film by using TM plasma, and the improvement in the NBTI lifetime due to shallow nitrogen profile of fabricated specimen were reported.
Keywords :
MOSFET; dielectric thin films; nitridation; plasma materials processing; silicon compounds; 90 nm; NBTI lifetime; SiON; SiON film; negative bias temperature instability; plasma nitridation; shallow nitrogen profile; Apertures; FETs; Low voltage; Niobium compounds; Nitrogen; Plasma applications; Plasma materials processing; Plasma measurements; Semiconductor films; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gate Insulator, 2003. IWGI 2003. Extended Abstracts of International Workshop on
Conference_Location :
Toyko, Japan
Print_ISBN :
4-89114-037-2
Type :
conf
DOI :
10.1109/IWGI.2003.159202
Filename :
1252527
Link To Document :
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