• DocumentCode
    239420
  • Title

    Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling

  • Author

    Preuss, Patrick ; Naumann, Andre ; Scholl, Wolfgang ; Boon Ping Gan ; Lendermann, Peter

  • Author_Institution
    D-SIMLAB Technol. GmbH, Dresden, Germany
  • fYear
    2014
  • fDate
    7-10 Dec. 2014
  • Firstpage
    2444
  • Lastpage
    2453
  • Abstract
    Material flow forecast based on Short-Term Simulation has been established as a decision support solution for fine-tuning of Preventive Maintenance (PM) timing at Infineon Dresden. To ensure stable forecast quality for effective PM decision making, the typical tool uptime behavior needs to be portrayed accurately. In this paper, we present a hybrid tool down modeling approach that selectively combines deterministic and random down time modeling based on historical tool uptime behavior. The method allowed to approximate the daily uptime of reality in simulation. A generic framework to model historical down behavior of any distribution type, described by the two parameters Mean Time to Failure (MTTF) and Mean Time to Repair (MTTR) is also discussed.
  • Keywords
    decision making; failure analysis; forecasting theory; preventive maintenance; quality control; semiconductor device manufacture; Infineon Dresden; decision support solution; hybrid tool down time modeling; material flow forecasting; mean-time-to-failure; mean-time-to-repair; preventive maintenance; quality forecasting; semiconductor manufacturing; short-term simulation; Analytical models; Data models; Gallium nitride; Maintenance engineering; Predictive models; Radiation detectors; Stochastic processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), 2014 Winter
  • Conference_Location
    Savanah, GA
  • Print_ISBN
    978-1-4799-7484-9
  • Type

    conf

  • DOI
    10.1109/WSC.2014.7020088
  • Filename
    7020088