DocumentCode :
239442
Title :
Evaluations on scheduling in semiconductor manufacturing by backward simulation
Author :
Scholl, Wolfgang ; Laroque, Christoph ; Weigert, Gerald
Author_Institution :
Infineon Technol. Dresden, Dresden, Germany
fYear :
2014
fDate :
7-10 Dec. 2014
Firstpage :
2552
Lastpage :
2560
Abstract :
Manufacturing is today often characterized by a growing number of customer-specific products that have to be manufactured and delivered in given lead times, according to concrete delivery dates. Thus, highly relevant questions like “When to start a production order at latest, in order to stay within my lead time?” are answered by more or less primitive, backward-oriented planning approaches and without taking into consideration uncertainty or alternatives. It gets more complex, if different products are to be produced and the more complex the underlying manufacturing system is (e.g. semiconductor with re-entry cycles). These questions could be answered more specifically, more detailed and more robust, if discrete, event-based simulation (DES) would be applied in a backward-oriented manner. This paper describes evaluation results from the semiconductor domain and names restrictions and limits. They also show, that the backward-oriented simulation approach can be applied successfully for the scheduling of customer-specific orders.
Keywords :
discrete event simulation; planning; production engineering computing; scheduling; semiconductor device manufacture; DES; backward-oriented planning approach; backward-oriented simulation approach; concrete delivery dates; customer-specific order scheduling; customer-specific products; discrete event-based simulation; name restrictions; names limits; semiconductor domain; semiconductor manufacturing; Analytical models; Job shop scheduling; Manufacturing; Optimization; Planning; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference (WSC), 2014 Winter
Conference_Location :
Savanah, GA
Print_ISBN :
978-1-4799-7484-9
Type :
conf
DOI :
10.1109/WSC.2014.7020099
Filename :
7020099
Link To Document :
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