DocumentCode
2394493
Title
3-D microfabricated electrodes for targeted deep brain stimulation
Author
Laotaveerungrueng, Noppasit ; Lin, Chia-Hua ; McCallum, Grant ; Rajgopal, Srihari ; Steiner, Charles P. ; Rezai, Ali R. ; Mehregany, Mehran
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
fYear
2009
fDate
3-6 Sept. 2009
Firstpage
6493
Lastpage
6496
Abstract
This work presents a novel 4-sided, 16-channel deep brain stimulation electrode with a custom flexible high-density lead for connectivity with pulse generation electronics. The 3-dimensional electrode enables steering the current field circumferentially. The electrode is fabricated in pieces by micromachining and microfabrication techniques; the pieces are then assembled mechanically to form the electrode, after which the lead is connected. The electrode is modeled by finite element analysis and tested in vitro to validate the design concept, i.e., targeted stimulation. Simulation and experimental results for a targeted stimulation show close agreement. With a symmetric bipolar stimulation configuration, within a 3 mm radius, the electric potential in front of the activated side is at least 3.6 times larger than that on the corresponding two adjacent, not-activated sides, and 9 times larger than the corresponding opposite, not-activated side.
Keywords
bioMEMS; bioelectric potentials; biomedical electrodes; brain; finite element analysis; micromachining; neurophysiology; 16-channel deep brain stimulation electrode; 3-dimensional electrode; electric potential; finite element analysis; flexible high-density lead; microfabrication; micromachining; pulse generation electronics; symmetric bipolar stimulation configuration; Computer-Aided Design; Deep Brain Stimulation; Electrodes, Implanted; Equipment Design; Equipment Failure Analysis; Miniaturization; Reproducibility of Results; Sensitivity and Specificity;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location
Minneapolis, MN
ISSN
1557-170X
Print_ISBN
978-1-4244-3296-7
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2009.5333591
Filename
5333591
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