DocumentCode :
2394510
Title :
Effects of the electrical double layer and dispersive tissue properties in a volume conduction model of deep brain stimulation
Author :
Grant, Peadar F ; Lowery, Madeleine M.
Author_Institution :
Sch. of Electr., Electron. & Mech. Eng., Univ. Coll. Dublin, Dublin, Ireland
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
6497
Lastpage :
6500
Abstract :
The aim of this study was to investigate the interaction of the electrode-tissue interface and dispersive tissue properties on waveforms used for deep brain stimulation. A finite element model with a distributed impedance electrical double layer was developed. Bulk tissue capacitance and dispersion were found to alter the voltage waveform under constant current stimulation. When the electrode was surrounded by conductive saline or white matter tissue, the electrical double layer was dominant under voltage controlled stimulation. However, as encapsulation tissue resistivity was increased, to emulate chronic stimulation, the voltage waveform approached that observed during constant current stimulation and the influence of the frequency dependent material properties again became dominant.
Keywords :
bioelectric phenomena; biological tissues; diseases; electrical resistivity; finite element analysis; neurophysiology; patient treatment; physiological models; bulk tissue capacitance; conductive saline; deep brain stimulation; dispersive tissue properties; distributed impedance layer; electrical double layer effects; electrode-tissue interface; encapsulation tissue resistivity; finite element model; frequency-dependent material properties; voltage controlled stimulation; voltage waveform; volume conduction model; white matter tissue; Action Potentials; Animals; Brain; Computer Simulation; Deep Brain Stimulation; Humans; Models, Neurological; Nerve Net; Neural Conduction; Therapy, Computer-Assisted;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5333592
Filename :
5333592
Link To Document :
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