DocumentCode :
2394625
Title :
Evaluation on ESD robustness of LTPS diode and TFT device by transmission line pulsing (TLP) technique
Author :
Ker, Ming-Dou ; Tseng, Tang-Kui ; Yang, Sheng-Chieh ; Shih, An ; Tsai, Yaw-Ming
Author_Institution :
Inst. of Electron., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear :
2003
fDate :
6-8 Oct. 2003
Firstpage :
88
Lastpage :
91
Abstract :
ESD robustness of Low Temperature Poly-Si (LTPS) diodes and TFT devices has been investigated in this paper. By using the Transmission Line Pulsing (TLP) techniques, the It2 (secondary breakdown current) of LTPS diodes and TFT devices were measured. To evaluate the ESD robustness of components for ESD protection, the shifts of breakdown voltage and cut-in voltage of LTPS diode and TFT devices after TLP stress are considered into failure threshold judgment. From the experimental results, It2 of LTPS diodes under forward-biased stress is better than that of LTPS TFT devices. Furthermore, the It2 of LTPS TFT devices under reverse-biased stress is more robust than it under forward-biased stress. Such investigation results can help us to design a successful ESD protection for the circuits on glass.
Keywords :
electrostatic discharge; elemental semiconductors; failure analysis; reliability; robust control; semiconductor device breakdown; semiconductor diodes; silicon; thin film transistors; ESD robustness; Si; TFT device; breakdown voltage; failure threshold judgment; forward-biased stress; low temperature poly-Si diodes; reverse-biased stress; secondary breakdown current; transmission line pulsing; Current measurement; Diodes; Electric breakdown; Electrostatic discharge; Protection; Robustness; Stress; Temperature; Thin film transistors; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications, 2003 International Symposium on
ISSN :
1524-766X
Print_ISBN :
0-7803-7765-6
Type :
conf
DOI :
10.1109/VTSA.2003.1252559
Filename :
1252559
Link To Document :
بازگشت