RF wireless integration

Integration of RF wireless systems is fundamentally different at lower and higher frequencies. Rather arbitrarily the division can be placed at around 3 GHz. At higher frequencies the most important systems are those for wireless connectivity. It will be shown that eventually CMOS will be the preferred technology because it can offer the needed bandwidth better than bipolar. However, for several reasons RF-CMOS will in general not be integrated with digital CMOS on one chip, except for some specific simple systems. Foundries and fabless design houses may follow a different strategy from vertically integrated companies. At lower frequencies the most important systems in which RF integration is key are those for cellular communication. An overview is given of the needs and options for integrating passive components and technologies together with the RF active parts in a multichip package or module approach. Only the consumer/handset applications are treated, because in basestations integration has only a low priority.