Emerging technologies for wireless handsets

Author

Pacheco, Sergio ; Keser, Beth ; Liu, Lianjun ; Abrokwah, Jon

Author_Institution

Freescale Semicond., Inc., Tempe

fYear

2007

fDate

Oct. 29 2007-Nov. 1 2007

Firstpage

770

Lastpage

777

Abstract

This paper discuss three emerging disruptive technologies that have the potential to simplify front-end module designs as the wireless handset community moves forward through 2.5G to 3G and 4G architectures. Integrated passives devices (IPD) is an approach to provide high quality integrated passives using semiconductor processing instead of surface mount devices. Redistributed chip packaging (RCP) is a novel technique to integrate heterogeneous die while providing unmatched density. RF MEMS technology is at the cusp of finally providing a revolutionary paradigm shift in front-end module architecture.

Keywords

3G mobile communication; 4G mobile communication; chip scale packaging; micromechanical devices; mobile handsets; semiconductor technology; 2.5G architectures; 3G architectures; 4G architectures; RF MEMS technology; disruptive technologies; front-end module designs; heterogeneous die; integrated passives devices; redistributed chip packaging; semiconductor processing; wireless handsets; Costs; GSM; Inductors; Metal-insulator structures; Q factor; RF signals; Radio frequency; Radiofrequency microelectromechanical systems; Semiconductor device packaging; Telephone sets; front-end module; integrated passives; redistributed chip packaging; rf mems;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Optoelectronics Conference, 2007. IMOC 2007. SBMO/IEEE MTT-S International

Conference_Location

Brazil

Print_ISBN

978-1-4244-0661-6

Electronic_ISBN

978-1-4244-0661-6

Type

conf

DOI

10.1109/IMOC.2007.4404373

Filename

4404373