DocumentCode
2395445
Title
VLSI interconnects at multi GHz frequencies incorporating inductance
Author
Azadpour, M. ; Kalkur, T.
Author_Institution
Colorado Univ. at Colorado Springs, Boulder, CO, USA
fYear
2003
fDate
2003
Firstpage
276
Lastpage
279
Abstract
Due to decreasing device sizes and increasing clock speed, the interconnect delay is the dominant factor in clock skew. This delay has been extracted as RC component in available EDA tools. In this paper, we model the interconnect as RLC for systems running at multi-GHz. A static extraction analysis method optimized for VLSI is detailed which considers all lines within the vicinity of the target line as return paths. Novel formulas presented for parallel and series RLC reduction. Result characterization and future research areas are discussed.
Keywords
RC circuits; RLC circuits; VLSI; inductance; integrated circuit interconnections; integrated circuit modelling; EDA tools; RC component; VLSI interconnect delay; clock skew; clock speed; electronic design automation; inductance; parallel RLC reduction; series RLC reduction; static extraction analysis; target line; Clocks; Data mining; Delay; Frequency; Impedance; Inductance; Integrated circuit interconnections; Springs; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 2003 International Symposium on
ISSN
1524-766X
Print_ISBN
0-7803-7765-6
Type
conf
DOI
10.1109/VTSA.2003.1252607
Filename
1252607
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