DocumentCode :
2396525
Title :
Design and fabrication of neural implant with thick microchannels based on flexible polymeric materials
Author :
Benmerah, Samia ; Lacour, Stéphanie P. ; Tarte, Edward
Author_Institution :
Sch. of Eng., Univ. of Birmingham, Birmingham, UK
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
6400
Lastpage :
6403
Abstract :
Mechanical guidance can be used to provide a supporting structure through which and onto which regenerating axons can grow. The dimensions of the mechanical guide need to be suitable to support regenerated axon outgrowth and vascularisation. In this paper, we present the design and fabrication process of a three-dimensional (3D) device comprising a bundle of parallel (100mum times 100mum) microchannels with embedded electrodes. This device can be used as a 3D electrode interface for peripheral nerve repair. The skeleton of the device is entirely made of flexible polyimide films. Gold microelectrodes and microchannels of photosensitive polyimide are patterned directly on polyimide substrates. After fabrication, the 2D electrode channel array is rolled into a 3D channel bundle that fits the anatomy of the peripheral nerve. Samples are rolled and inserted into 1.5 mm inner diameter tube.
Keywords :
bioMEMS; biomedical electrodes; gold; microchannel flow; microelectrodes; neurophysiology; polymer films; prosthetics; 2D electrode channel array; 3D channel bundle; axon regeneration; flexible polymeric material; gold microelectrode; mechanical guidance; mechanical guide; microchannels; neural implant fabrication; peripheral nerve repair; photosensitive polyimide film; size 100 mum; supporting structure; three-dimensional device; vascularisation; Action Potentials; Elastic Modulus; Electrodes, Implanted; Equipment Design; Equipment Failure Analysis; Guided Tissue Regeneration; Miniaturization; Nerve Regeneration; Peripheral Nerves; Polymers; Prostheses and Implants;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5333723
Filename :
5333723
Link To Document :
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