Title :
A life cycle model for the WSI associative string processor (WASP)
Author :
Peacock, Chris ; Bolouri, Hamid ; Lea, Mike
Author_Institution :
Eng. Res. & Dev. Centre, Hertfordshire Univ., Hatfield, UK
Abstract :
The paper presents a comprehensive life cycle model for the WSI associative string processor (WASP) which simulates the manufacture, acceptance, and operational life of a hypothetical target device. After 100,000 hours of continuous simulated operation, the device is shown to support an average of over 8.5 K APEs per wafer under a worst case scenario, and an average of over 12 K APEs per wafer under an expected case scenario
Keywords :
associative processing; wafer-scale integration; 100000 hour; WASP; WSI associative string processor; acceptance; life cycle model; manufacture; operational life; simulation; target device; Circuit faults; Fault tolerance; Integrated circuit interconnections; Life testing; Manufacturing processes; Predictive models; Pulp manufacturing; Research and development; Semiconductor device modeling; Virtual manufacturing;
Conference_Titel :
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2467-6
DOI :
10.1109/ICWSI.1995.515438
