DocumentCode :
2397236
Title :
CCD wafer scale integration
Author :
Suni, Paul P.
Author_Institution :
Orbit Semicond. Inc., Sunnyvale, CA, USA
fYear :
1995
fDate :
18-20 Jan 1995
Firstpage :
123
Lastpage :
133
Abstract :
Wafer scale CCD photodetector arrays of 26 million pixels or more are being fabricated on a limited production basis today. This paper provides an introduction to CCD wafer scale integration with an emphasis on common wafer scale CCD design architectures, applications and fabrication processes. Examples of wafer scale CCD products are reviewed, and a triple poly, double metal wafer scale CCD fabrication process is discussed in comparison with typical digital CMOS processes. Very large area CCD photodetector arrays designed and fabricated by Orbit Semiconductor are discussed in some detail. These include an 8 million pixel 3 cm by 6 cm wafer scale CCD imager for digital photography and a family of CCD sensors for intraoral digital dental radiography. Finally, future possibilities in wafer scale CCD´s are discussed
Keywords :
CCD image sensors; integrated circuit design; integrated circuit technology; wafer-scale integration; 26 Mpixel; 3 cm; 6 cm; 8 Mpixel; CCD imager; CCD photodetector arrays; CCD sensors; CCD wafer scale integration; Orbit Semiconductor; design architectures; digital photography; intraoral digital dental radiography; triple poly double metal fabrication; CMOS process; Charge coupled devices; Charge-coupled image sensors; Dentistry; Digital photography; Fabrication; Photodetectors; Pixel; Production; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2467-6
Type :
conf
DOI :
10.1109/ICWSI.1995.515446
Filename :
515446
Link To Document :
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