DocumentCode :
2397253
Title :
A substrate area estimation technique for Multi-Chip Modules
Author :
Habiger, C.M.
Author_Institution :
Electron. Inst., Swiss Federal Inst. of Technol., Zurich, Switzerland
fYear :
1995
fDate :
18-20 Jan 1995
Firstpage :
134
Lastpage :
142
Abstract :
The estimation of substrate areas of Multi-Chip Modules is a very important task in the partitioning of a MCM based electronic system. Moreover, due to the similarities between large area MCMs (hybrid-WSI) and monolithic-WSI it has become increasingly clear that regular structures are significantly better suited than others for implementation in these technologies. This paper introduces a substrate area estimation for MCMs with regular structures, using Massively Parallel Computers as an example
Keywords :
multichip modules; parallel machines; substrates; wafer-scale integration; Massively Parallel Computers; Multi-Chip Modules; electronic systems; hybrid-WSI; large area MCMs; partitioning; regular structures; substrate area estimation; Application software; Concurrent computing; Consumer electronics; Costs; Data processing; Embedded computing; Environmental economics; Packaging; Signal processing; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2467-6
Type :
conf
DOI :
10.1109/ICWSI.1995.515447
Filename :
515447
Link To Document :
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