• DocumentCode
    2397253
  • Title

    A substrate area estimation technique for Multi-Chip Modules

  • Author

    Habiger, C.M.

  • Author_Institution
    Electron. Inst., Swiss Federal Inst. of Technol., Zurich, Switzerland
  • fYear
    1995
  • fDate
    18-20 Jan 1995
  • Firstpage
    134
  • Lastpage
    142
  • Abstract
    The estimation of substrate areas of Multi-Chip Modules is a very important task in the partitioning of a MCM based electronic system. Moreover, due to the similarities between large area MCMs (hybrid-WSI) and monolithic-WSI it has become increasingly clear that regular structures are significantly better suited than others for implementation in these technologies. This paper introduces a substrate area estimation for MCMs with regular structures, using Massively Parallel Computers as an example
  • Keywords
    multichip modules; parallel machines; substrates; wafer-scale integration; Massively Parallel Computers; Multi-Chip Modules; electronic systems; hybrid-WSI; large area MCMs; partitioning; regular structures; substrate area estimation; Application software; Concurrent computing; Consumer electronics; Costs; Data processing; Embedded computing; Environmental economics; Packaging; Signal processing; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-2467-6
  • Type

    conf

  • DOI
    10.1109/ICWSI.1995.515447
  • Filename
    515447