• DocumentCode
    2397331
  • Title

    Phase space acceptance of LMF transport schemes

  • Author

    Olson, C.L.

  • Author_Institution
    Sandia Nat. Lab., Albuquerque, NM, USA
  • fYear
    1989
  • fDate
    20-23 Mar 1989
  • Firstpage
    1011
  • Abstract
    Three different ion beam transport schemes (achromatic lens, wire-guided transport, and Z-discharge channel) for the light ion beam driver for the Laboratory Microfusion Facility (LMF) are examined analytically. For each case the phase space acceptance area is investigated, including the effects of angular momentum. It is shown that, in real diode/transport configurations, there will be some angular momentum (i.e. φ0≠0) created, e.g. by combinations of diode microdivergence, beam steering errors, foil scattering, and gas scattering. Both the ballistic/lens case and the channel case can accept φ0=0 beams if they can be made, and can also tolerate certain amounts of φ0≠0. On the other hand, the wire case requires φ0≠0 in a carefully prepared manner. It is concluded that, in regard to angular momentum, the baseline ballistic case is the most accepting transport scheme. The channel transport scheme is less accepting. The wire transport scheme is the least accepting because it requires a tailored nonzero φ0 distribution to be fully accepted
  • Keywords
    beam handling equipment; collective accelerators; fusion reactor theory and design; ion accelerators; ICF; LMF transport schemes; Laboratory Microfusion Facility; Z-discharge channel; achromatic lens; angular momentum; beam steering errors; channel transport scheme; diode microdivergence; foil scattering; gas scattering; ion beam transport schemes; light ion beam driver; linear induction accelerator; phase space acceptance area; wire-guided transport; Ballistic transport; Diodes; Ion beams; Laboratories; Lenses; Magnetic fields; Space charge; Trajectory; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 1989. Accelerator Science and Technology., Proceedings of the 1989 IEEE
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/PAC.1989.73337
  • Filename
    73337