Title :
A comparison of VLSI, MCM and WSI technologies
Author :
Swartzlander, Earl E., Jr.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Abstract :
VLSI, MCM and WSI technologies are compared on the basis of silicon area, substrate size and power consumption. Theoretical estimates for these parameters are developed and then illustrated by examining the design of a radix-4 FFT butterfly processing element. The MCM implementation should cost the least in production, but it is the largest and consumes the most power
Keywords :
VLSI; integrated circuit technology; multichip modules; wafer-scale integration; MCM technology; Si; Si area; VLSI technology; WSI technology; power consumption; radix-4 FFT butterfly processing element; substrate size; Capacitance; Circuit faults; Cost function; Energy consumption; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit technology; Silicon; Very large scale integration; Wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2467-6
DOI :
10.1109/ICWSI.1995.515453
