DocumentCode :
2398147
Title :
Achieving the enhanced reliability of electronic system by application of EMI control measures
Author :
Deb, G.K.
Author_Institution :
Electron. Res. & Dev. Centre of India, Calcutta, India
fYear :
1997
fDate :
18-22 Aug 1997
Firstpage :
439
Lastpage :
443
Abstract :
EMC is practiced in efficient operation, maintenance of reliability and safety of various electronic systems used in military and civil sectors and medicare. In the Indian context, it is essential to make indigenous products acceptable and competitive in domestic and international markets, especially in the European union, by designing reliable equipment. This paper addresses the following: (a) quality control for VLSI based systems through good EMC design practices, (b) sub-system module packaging, (c) hardening of electronic components for EMC and reliability, (d) protection of transient effects on digital circuits, (e) component-value-optimisation and (f) EMC maintenance considerations. The measurement results complying with the FCC specifications (class B) are included for a microprocessor subsystem
Keywords :
VLSI; electromagnetic compatibility; electromagnetic interference; interference suppression; maintenance engineering; microprocessor chips; packaging; quality control; reliability; safety; EMC; EMC design practices; EMC maintenance considerations; EMI control measures; FCC specifications; India; VLSI based systems; civil sector; class B specifications; component-value-optimisation; digital circuits; efficient operation; electronic components hardening; electronic system; maintenance; microprocessor subsystem; military sector; quality control; reliability enhancement; safety; sub-system module packaging; transient effects protection; Digital circuits; Electromagnetic compatibility; Electronic components; Electronics packaging; Maintenance; Packaging machines; Protection; Quality control; Safety; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4140-6
Type :
conf
DOI :
10.1109/ISEMC.1997.667720
Filename :
667720
Link To Document :
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