Title :
Cost of ownership for advanced optical lithography
Author :
DiSessa, Peter ; Stone, Stanley
Author_Institution :
GCA, Andover, MA, USA
Abstract :
An IC wafer fab model has been developed to predict the cost per good device produced by a wafer stepper that will allow comparisons to be made between various IC devices and various wafer lithography equipment capabilities. The model provides the versatility and flexibility to be tailored to any particular IC production environment, and to any particular optical wafer stepper capability. It is noted that the technical advances made in the areas of i-line and deep-UV reduction stepper lithography have led to a truly production-worthy lithography process. These advances have responded to some of the key challenges for optical microlithography, and have increased the productivity and utilization of the steppers. Advances in the area of reduction optics, i-line illumination, excimer lasers, alignment and in-situ metrology have all had a significant impact on the technical performance of the stepper, as well as its productivity and utilization
Keywords :
integrated circuit technology; laser beam applications; photolithography; IC production environment; IC wafer fab model; advanced optical lithography; alignment; deep-UV reduction stepper; excimer lasers; i-line illumination; i-line lithography; microlithography; productivity; reduction optics; wafer lithography equipment; wafer stepper; Costs; Integrated circuit modeling; Lighting; Lithography; Metrology; Photonic integrated circuits; Predictive models; Production; Productivity; Semiconductor device modeling;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1991. ASMC 91 Proceedings. IEEE/SEMI 1991
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-0152-8
DOI :
10.1109/ASMC.1991.167383
