Combining new, high-power packages with high-power ICs answers need for hermetic, military motor control electronics

Author

Emerald, Paul R.

Author_Institution

Sprague Semicond. Group, Worcester, MA, USA

fYear

1989

fDate

13-17 Mar 1989

Firstpage

188

Lastpage

194

Abstract

Two high-power hermetic packages have been tooled that offer the combination of increased lead-count and thermal ratings needed to provide military-grade power ICs. This work concerns the two package styles, and the initial high-power motor ICs that utilize them. The first is a 15-lead TO-204 style (formerly called the TO-3), that uses conventional materials, form factor, and manufacturing techniques. The second involves a high-power dual in line pin (DIP) configuration with enhanced heat dissipation (and therefore power handling) capabilities

Keywords

controllers; electric motors; machine control; military equipment; packaging; power integrated circuits; TO-204; controllers; dual in line pin; form factor; heat dissipation; hermetic packages; machine control; manufacturing; military motor control electronics; power ICs; Brushless DC motors; Consumer electronics; DC motors; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Motor drives; Power integrated circuits; Semiconductor device packaging; Servomotors;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 1989. APEC' 89. Conference Proceedings 1989., Fourth Annual IEEE

Conference_Location

Baltimore, MD

Type

conf

DOI

10.1109/APEC.1989.36968

Filename

36968