Title :
IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370)
Abstract :
The following topics were dealt with: system design issues; on-chip interconnections; measurements; mixed signal and optical packaging design; power distribution modelling; simultaneous switching noise; power supply decoupling; substrate modelling; microwave packaging; modelling techniques; accelerated modelling
Keywords :
packaging; accelerated modelling; electrical performance; electronic packaging; measurements; microwave packaging; mixed signal packaging; modelling techniques; on-chip interconnections; optical packaging design; power distribution modelling; power supply decoupling; simultaneous switching noise; substrate modelling; system design issues;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY, USA
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733470
