Title :
Future challenges in IC testing and fault isolation
Author :
Vallett, David P.
Author_Institution :
IBM Microelectron. Div., USA
Abstract :
Integrated circuit (IC) production is critically dependent on characterization and failure analysis (FA) (Ref. 1). Experiment evaluation, technology qualification, yield and reliability learning, and time-to-market are driven by rapid and accurate FA. Testing and fault isolation are essential in identifying electrical faults and in localizing them to regions small enough to be examined by high-resolution electron and scanning-probe microscopes. This presentation introduces IC characterization and failure analysis, discusses their roles in manufacturing, and examines limitations imposed by shrinking features, lower supply voltages, and smaller design margins. R&D needs are also projected based on the CMOS IC technology roadmap (Ref. 1).
Keywords :
electron microscopes; failure analysis; fault location; integrated circuit reliability; integrated circuit testing; integrated circuit yield; scanning probe microscopy; IC testing; electrical faults; electron microscope; failure analysis; fault isolation; integrated circuit production; reliability learning; scanning-probe microscopes; technology qualification; CMOS technology; Circuit faults; Circuit testing; Failure analysis; Integrated circuit technology; Integrated circuit testing; Integrated circuit yield; Isolation technology; Production; Qualifications;
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
Print_ISBN :
0-7803-7888-1
DOI :
10.1109/LEOS.2003.1252912
