DocumentCode :
2400313
Title :
High average beam power linac waveguides
Author :
Gallagher, W.J.
Author_Institution :
Boeing Aerosp. Co., Seattle, WA, USA
fYear :
1989
fDate :
20-23 Mar 1989
Firstpage :
1064
Abstract :
The constant gradient condition with an intended beam loading is investigated. The motive for the investigation is the observation that when a method of heat removal from a length of waveguide has been developed, the whole waveguide can be operated advantageously at the given rate of RF heat deposition. The heat transfer process implies a maximum power attenuation per unit length (2IP), where 2I is the power attenuation coefficient (nepers/m). Achievement of high beam power linacs implies that this power attenuation ought to be used along the entire waveguide length. As a consequence, the waveguide design will automatically be constant gradient, since the field strength E2=2IPr and the shunt impedance per unit length is nearly constant. As an application, the author considers the design of a continuous-wave (CW) traveling wave linear accelerator intended for operation at 1 A, having a 4-MW, L-band RF power source, and where what is wanted is 80% beam power conversion efficiency (η-0.8), which therefore implies an energy gain per section of 3.2 MeV
Keywords :
beam handling equipment; beam handling techniques; linear accelerators; L-band RF power source; RF heat deposition; beam loading; beam power conversion efficiency; constant gradient condition; continuous-wave; energy gain per section; field strength; heat removal; heat transfer process; high beam power linacs; maximum power attenuation per unit length; power attenuation coefficient; shunt impedance; traveling wave linear accelerator; waveguide; Aerospace engineering; Attenuation; Electromagnetic heating; Equations; Heat transfer; Impedance; Information geometry; Laboratories; Linear particle accelerator; Power conversion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Particle Accelerator Conference, 1989. Accelerator Science and Technology., Proceedings of the 1989 IEEE
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/PAC.1989.73355
Filename :
73355
Link To Document :
بازگشت