Title :
High density surface mounting power supply
Author :
Bui, L. ; Petit, M. ; Val, C.M.
Author_Institution :
Thomson-CSF/Dept., CIMSA-SINTRA, Colombes, France
Abstract :
The various stages in the design of a high-density surface-mounted power supply are described, including the development of the passive power components, power chip carrier package, and interconnection substrate. Emphasis is on the design and minimization of the power ceramic capacitor, quadrupole capacitor, and transformer components. The construction of a 16-60 V/5 V 20 A DC-DC converter using this technology has demonstrated that performance improvement and additional miniaturization requires the optimization of the pulse-width modulator of the power converter
Keywords :
power convertors; power supplies to apparatus; surface mount technology; 16 to 60 V; 20 A; 5 V; DC-DC converter; high-density surface-mounted power supply; interconnection substrate; passive power components; power chip carrier package; Capacitance; Ceramics; Electric resistance; Inductance; Integrated circuit packaging; Manufacturing; Power capacitors; Power supplies; Pulse width modulation; Substrates;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1989. APEC' 89. Conference Proceedings 1989., Fourth Annual IEEE
Conference_Location :
Baltimore, MD
DOI :
10.1109/APEC.1989.36979
