• DocumentCode
    2400626
  • Title

    First Wafer Delay and setup: How to measure, define and improve First Wafer Delays and setup times in semiconductor fabs

  • Author

    Radloff, Stefan ; Abravanel, Mario ; Rhoads, Blane ; Steeg, Dylan ; Van der Meulen, Peter ; Petraitis, Martin

  • Author_Institution
    Intel Corp., Andover, MA, USA
  • fYear
    2009
  • fDate
    10-12 May 2009
  • Firstpage
    86
  • Lastpage
    90
  • Abstract
    First wafer delay (FWD) has been identified as a barrier to reduced fab cycle time and increased equipment productivity. As such, initiatives to reduce first wafer delay have been proposed as a focal point for next generation semiconductor fabs, including both 450 mm fabs as well as ldquo300 mm Primerdquo factories. FWD and setup time are major detractors for cycle time reduction, in particular for small lot manufacturing. The definition of FWD, causes, as well as methods for improving FWD are discussed, in addition to recommendations for future equipment and factory design.
  • Keywords
    semiconductor process modelling; wafer bonding; cycle time reduction; first wafer delay; semiconductor fabs; setup time; size 450 nm; Computer architecture; Delay effects; Production facilities; Productivity; Scheduling algorithm; Semiconductor device manufacture; Semiconductor device modeling; Testing; Throughput; Time measurement; 300mm Prime; 450mm fabs; First wafer delay; cycle time; setup time;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
  • Conference_Location
    Berlin
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-3614-9
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2009.5155959
  • Filename
    5155959