DocumentCode
2400806
Title
Low-k wafer scribing using water jet-guided laser technology with 10 ns lasers
Author
Pauchard, A. ; Obi, S. ; Lee, K. ; Richerzhagen, B.
Author_Institution
Chemin de la Dent d´´Oche, Synova SA, Ecublens, Switzerland
fYear
2009
fDate
10-12 May 2009
Firstpage
115
Lastpage
118
Abstract
This paper presents the latest results of low-k wafer scribing using short pulse lasers in combination with water jet-guided laser technology.
Keywords
laser beam cutting; permittivity; semiconductor technology; water jet cutting; low-k wafer scribing; short pulse lasers; water jet-guided laser technology; Blades; Dielectric materials; Dielectric substrates; Fiber lasers; Laser beam cutting; Manufacturing; Optical pulses; Power lasers; Semiconductor lasers; Water jet cutting;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location
Berlin
ISSN
1078-8743
Print_ISBN
978-1-4244-3614-9
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2009.5155968
Filename
5155968
Link To Document