DocumentCode :
2400806
Title :
Low-k wafer scribing using water jet-guided laser technology with 10 ns lasers
Author :
Pauchard, A. ; Obi, S. ; Lee, K. ; Richerzhagen, B.
Author_Institution :
Chemin de la Dent d´´Oche, Synova SA, Ecublens, Switzerland
fYear :
2009
fDate :
10-12 May 2009
Firstpage :
115
Lastpage :
118
Abstract :
This paper presents the latest results of low-k wafer scribing using short pulse lasers in combination with water jet-guided laser technology.
Keywords :
laser beam cutting; permittivity; semiconductor technology; water jet cutting; low-k wafer scribing; short pulse lasers; water jet-guided laser technology; Blades; Dielectric materials; Dielectric substrates; Fiber lasers; Laser beam cutting; Manufacturing; Optical pulses; Power lasers; Semiconductor lasers; Water jet cutting;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location :
Berlin
ISSN :
1078-8743
Print_ISBN :
978-1-4244-3614-9
Electronic_ISBN :
1078-8743
Type :
conf
DOI :
10.1109/ASMC.2009.5155968
Filename :
5155968
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2400806
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