DocumentCode :
2400924
Title :
Contamination induced risk reduction through improved control plan implementation
Author :
Maillot, P. ; Le Gall, M. ; Pic, N. ; Martin, C.
Author_Institution :
STMicroelectronics, Rousset, France
fYear :
2009
fDate :
10-12 May 2009
Firstpage :
161
Lastpage :
163
Abstract :
Background and details on an optimized control plan for metal contamination monitoring have been described. It must be emphasized that this control plan can only be defined and sustained through close interaction of R&D, Metrology, Process control and Production people.
Keywords :
contamination; control engineering computing; health and safety; process monitoring; semiconductor industry; statistical process control; R&D; metallic contamination; monitoring; optimized control plan; process control; production; risk reduction; Annealing; Degradation; Iron; Manufacturing processes; Monitoring; Pollution measurement; Risk management; Silicides; Silicon; Surface contamination;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location :
Berlin
ISSN :
1078-8743
Print_ISBN :
978-1-4244-3614-9
Electronic_ISBN :
1078-8743
Type :
conf
DOI :
10.1109/ASMC.2009.5155975
Filename :
5155975
Link To Document :
بازگشت