A new surface analysis method for semiconductor manufacturing, based on surface-potential measurements

The introduction of new materials into the process flow, the continuous reduction of device sizes, and the change in thermal budgets from new technologies, all require a continuous assessment and, if necessary, a development of new monitoring capabilities for defects and contamination in the semiconductor industry. Besides the detection of physical defects with optical wafer inspection systems, the detection of thin monolayer contamination, so called ldquonon-visiblerdquo residues (NVR), requires increasing attention. These surface contaminations change the local chemical state of the substrate surface and can be detected by the measurement of the surface potential difference across the wafer. In this study, we describe a method for improving analytical capabilities for contamination control in support of process engineering and development.