Fully automated multi sensor metrology for frontend use in MEMS and semiconductor

The class of surface metrology tools presented here fulfills the lab to production needs of semiconductor and microelectronics industry. The system automatically calculates TTV, bow or warp for wafers, PCB and device surfaces. Whole surface high resolution topography, roughness or profile measurements can be performed. An outstanding innovation is the modular multi sensor technology. The various optical sensors are fast and accurate, and the system can optionally be equipped with AFM. The system does automated evaluation of the following metrological data: total thickness variation TTV, bow, warp, roughness, film thickness, step height, pitch, profile, contour, edge structures, trenches, topography, geometry, co-planarity, critical dimensions and angles.