• DocumentCode
    2401118
  • Title

    Tool sensitivity analysis using neural net technique for yield improvement

  • Author

    Konkapaka, Phani Kumar ; Pinto, A. ; Giotta, P. ; Bhattacharya, S. ; Verma, G. ; Murashov, S. ; Pathak, M. ; Menner, M. ; Smith, B.G.

  • Author_Institution
    Qualcomm Inc., San Diego, CA, USA
  • fYear
    2009
  • fDate
    10-12 May 2009
  • Firstpage
    220
  • Lastpage
    222
  • Abstract
    In this paper we introduce the methodology of using neural networks (nonlinear regressions) as a yield ramp technique for new product introduction. Within a wafer fabrication facility, a large set of manufacturing equipment is used in sequential mode for IC manufacturing. As the technology scales, it is becoming more difficult to detect influential factors associated with specific equipment during a yield ramp. Using multiple iterations of neural networks on subsets of the yield ramp data, we have successfully isolated equipment sets that are most likely to influence yield very early in the yield ramp phase. This allows for a significantly shorter yield learning time.
  • Keywords
    neural nets; production engineering computing; production equipment; semiconductor device manufacture; sensitivity analysis; wafer level packaging; IC manufacturing; manufacturing equipment; multiple iterations; neural net technique; nonlinear regressions; tool sensitivity analysis; wafer fabrication; yield improvement; Analysis of variance; Data analysis; Manufacturing processes; Neural networks; Radio frequency; Radiofrequency identification; Semiconductor device manufacture; Sensitivity analysis; Testing; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
  • Conference_Location
    Berlin
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-3614-9
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2009.5155987
  • Filename
    5155987